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Volumn 31, Issue 2, 2005, Pages 50-56
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Liquid cooling for high-power electronics
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Author keywords
[No Author keywords available]
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Indexed keywords
COLD PLATES;
DIRECT BONDED COPPER (DBC);
HIGH POWER ELECTRONICS;
LIQUID COOLING;
COPPER PLATING;
CURRENT DENSITY;
DIES;
ELECTRIC CONDUCTIVITY;
ELECTRIC CONVERTERS;
ELECTRICITY;
HEAT FLUX;
HEAT RESISTANCE;
INSULATED GATE BIPOLAR TRANSISTORS;
SOLDERING;
THERMAL EFFECTS;
THERMAL EXPANSION;
POWER ELECTRONICS;
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EID: 14944357716
PISSN: 15402800
EISSN: None
Source Type: Journal
DOI: None Document Type: Review |
Times cited : (39)
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References (1)
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