A single layer negative tone lift-off photo resist for patterning a magnetron sputtered Ti/Pt/Au contact system and for solder bumps

Microelectronic Engineering

Volumn 78-79, Issue 1-4, 2005, Pages 503-508

  Voigt, A ^a   Heinrich, M ^a   Hauck, K ^b   Mientus, R ^c   Gruetzner, G ^a   Topper M ^b   Ehrmann, O ^b  

^a MICRO RESIST TECHNOLOGY GMBH   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c OUT EV   (Germany)

Author keywords

Lift off application; Lift off process; Multi layer contact system; Negative tone photoresist; Single layer; Solder bumps

Indexed keywords

COST EFFECTIVENESS; ELECTROPLATING; ENERGY DISPERSIVE SPECTROSCOPY; LIGHT EMITTING DIODES; MAGNETRON SPUTTERING; MELTING; PHYSICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; SMART CARDS; THERMODYNAMIC STABILITY; TITANIUM COMPOUNDS;

LIFT-OFF APPLICATION; LIFT-OFF PROCESSES; MULTI-LAYER CONTACT SYSTEMS; NEGATIVE TONE PHOTORESIST; SINGLE LAYER; SOLDER BUMPS;

PHOTORESISTS;

EID: 14944355334     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.12.064     Document Type: Conference Paper

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