Resin systems for wood composites rapidly e-beam cured at lower temperatures

2004 TAPPI Paper Summit - Spring Technical and International Environmental Conference

Volumn , Issue , 2004, Pages 373-385

  Griffith, W L ^a   Dorsey, G F ^b   Moschler Jr , W W ^b   Rials, T G ^b   Song, Ting ^b   Winistorfer, P M ^c   Song, Chang ^d  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

^b UNIVERSITY OF TENNESSEE   (United States)

^c VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^d IBA SteriGenics International Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY SAVINGS; RESIN SYSTEMS; RESIN-TO-WOOD BONDS; WOOD COMPOSITES;

AEROSPACE INDUSTRY; COSTS; ELECTRON BEAMS; ENERGY UTILIZATION; EPOXY RESINS; LOW TEMPERATURE EFFECTS; MECHANICAL PROPERTIES; PRODUCTION; STRUCTURAL PANELS;

WOOD PRODUCTS;

ELECTRON BEAMS; ENERGY CONSUMPTION; LOW TEMPERATURE; POLYEPOXIDES; SPACE (COSMIC); STRUCTURAL DESIGN; WOOD PRODUCTS;

EID: 14844294803     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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