Mechanical properties of copper-clad laminate using composite naphthalene-phenyl-based epoxy as prepreg

Journal of Applied Polymer Science

Volumn 95, Issue 6, 2005, Pages 1485-1492

  Duann, Yeh Fang ^a   Chen, Bor Lin ^a   Tsai, Teh Hua ^a  

^a NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

Copper clad laminate; Differential scanning calorimetry (DSC); Mechanical properties; Prepreg; Resins

Indexed keywords

ABSORPTION; CLAD METALS; COMPOSITE MATERIALS; COPPER; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; ETHERS; MECHANICAL PROPERTIES; MOISTURE; NAPHTHALENE; PERMITTIVITY; RESINS; THERMAL EXPANSION;

COPPER-CLAD LAMINATES; DICYANDIAMIDE (DICY); DISSIPATION FACTOR (DF); PREPREG;

LAMINATES;

COMPOSITE; MECHANICAL PROPERTY; PREPREG;

EID: 14644443528     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.21399     Document Type: Article

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