Thermal and mechanical analysis of polyurethane memory foam

American Laboratory

Volumn 37, Issue 1, 2005, Pages 16-19

  Cassel, R Bruce ^a   Bin Wadud, Sujan ^a  

^a TA INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; CROSSLINKING; CRYSTALLINE MATERIALS; DECOMPOSITION; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC MECHANICAL ANALYSIS; POLYURETHANES; RHEOMETERS; SURFACE ACTIVE AGENTS; THERMOANALYSIS; THERMOGRAVIMETRIC ANALYSIS; VISCOELASTICITY;

MODULATED DIFFERENTIAL SCANNING CALORIMETRY (MDSC); PARALLEL PLATE FIXTURES; REFRIGERATOR COOLING SYSTEMS (RCS); VISCOELASTIC SLABSTOCK FOAMS;

FOAMED PLASTICS;

EID: 14544290200     PISSN: 00447749     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (4)

1. Hagar S, Skorpenske R. Formulating technology for viscoelastic slabstock foam. Proceedings of the Technical Program of the Polyurethane Foam Association Meeting, Arlington, VA, May 10, 2001.
2. Danley RL. A new technology to improve DSC performance. Thermochim Acta 2003; 395:201-8.
3. Danley RL. New modulated DSC technique. Thermochim Acta 2003; 402:91-8.
4. Application brief. Characterization of Polyurethane by MDSC. Thermal Solutions, TS-38. New Castle, DE: TA Instruments, 1995.