Characterization of graded ti suicide coating formed by thermal diffusion treatment of low pressure plasma sprayed silicon coating

Proceedings of the International Thermal Spray Conference

Volumn 1, Issue , 1998, Pages 605-610

  Ohmori, A ^a   Zhou, Z ^b   Li, C J ^c  

^a OSAKA UNIVERSITY   (Japan)

^b Advanced Materials Processing Inst   (Japan)

^c XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; OPTICAL MICROSCOPY; OXIDATION; OXIDATION RESISTANCE; PLASMA SPRAYING; SCANNING ELECTRON MICROSCOPY; THERMAL DIFFUSION; TITANIUM COMPOUNDS; X RAY DIFFRACTION ANALYSIS;

SILICON COATINGS; SPRAY CHAMBERS;

SPRAYED COATINGS;

EID: 1442329993     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Murarku, S.P., Suicides for VLSI Applications, Academic Press, Orlando, FL, 1983.
2. Hung, L.S., J. Gyulai, J.W.Mayer, S.S.Lau and M.-A. Nicolet, J. Appl. Phys., 54(9), 5076-80(1983)
3. Lakshmikumar, S.T. and A.C. Rastogi, J. Vac. Sci. Technol. B 7 (4), 604-608 (1989).
4. Corcoran, Y.L. and A.H. King, J. Electronic Mater., 19 (11), 1177-83(1990).
5. Sandwick, T. and K. Rajan, J. Electronic Mater., 19(11), 1193-99(1990).
6. Revesz, P., J. Gyimesi and E Zsoldos, J. Appl. Phys., 54(4), 1860-64(1983).
7. Jeng, Y.-L and E.J. Lavernia, J. Mater, Sci., 29, 2557-71(1994).