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Volumn , Issue , 2001, Pages 51-55

Wide-Gap Transient Liquid Phase Bonding of TiAl Alloys Microstructural Development, Mechanical Properties and Automation

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE INTERLAYERS; TRANSIENT LIQUID PHASE (TLP) BONDING;

EID: 1442309036     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (1)

References (8)
  • 4
    • 1442284469 scopus 로고    scopus 로고
    • Eds. M. Singh, J.E. Indacochea and D. Hauser, ASM International, Materials Park, Ohio
    • V.L. Acoff and M. Arenas, pp. 101-105 in Joining of advanced and specialty materials, Eds. M. Singh, J.E. Indacochea and D. Hauser, ASM International, Materials Park, Ohio, (1998).
    • (1998) Joining of Advanced and Specialty Materials , pp. 101-105
    • Acoff, V.L.1    Arenas, M.2
  • 6
    • 4744346222 scopus 로고    scopus 로고
    • Eds: P.T. Vianco and M. Singh, American Welding Society, Miami, Florida and ASM International, Materials Park, Ohio
    • Q. Xu, M.C. Chaturvedi, N.L. Richards and N. Goel, pp 57-64 in Advanced Brazing and Soldering Technologies, Eds: P.T. Vianco and M. Singh, American Welding Society, Miami, Florida and ASM International, Materials Park, Ohio (2000).
    • (2000) Advanced Brazing and Soldering Technologies , pp. 57-64
    • Xu, Q.1    Chaturvedi, M.C.2    Richards, N.L.3    Goel, N.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.