Electrically mediated plating of PTHs and vias

Printed Circuit Fabrication

Volumn 24, Issue 3, 2001, Pages

  Taylor, E J ^a   Sun, J J ^a   Inman, M E ^a  

^a FARADAY TECHNOLOGY INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ASPECT RATIO; DIFFUSION IN SOLIDS; ELECTRIC FIELD EFFECTS; PLATING; SURFACE ROUGHNESS;

ELECTRICALLY MEDIATED PLATING; MICROVIAS; PERIODIC PULSE REVERSE; PULSE REVERSE CURRENT DEPOSITION;

MICROELECTRONIC PROCESSING;

EID: 14344272303     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)

1. Yung, E., et al., Journal of Electrochemical Society, vol. 13G, pg. 206, Jan. 1989.
2. Yung, E, and L. Romankiw, Journal of Electrochemical Society, vol. 136, pg. 756, March 1989.
3. Pearson, T., and J.K. Dennis, Journal of Applied Electrochemistry, vol. 20, pg. 196, 1990.
4. Coughlan, S., "Institute of Metal Finishing," May 1996.
5. van't Wout Hofland, Ronald, "Going in Reverse," PC FAB, Nov. 2000.
6. Milad, George, and Mark Lefebvre, "PPR Plating for HDI," PC FAB, Sept. 2000.
7. Blake, Ronald, et al., "Pulse Plating," PC FAB, Jan. 2000.
8. Taylor, E.J, et al., "Application of CM-ECD Process for HDI PCBs," IPC Printed Circuits Expo Proceedings, April 2000.
9. Taylor, E.J., "Metallization of Electronic Interconnects (HDI and ULSI) by Charge Modulated Control of Metal Distribution," AESF 5th International Pulse Plating Symposium, SUR/FIN Conference, June 2000.
10. Ibl, N., et al., Surface Technology, vol. 6, pg. 287, 1978.
11. Ibl, N., Surface Technology, vol. 10, pg. 81, 1980.
12. Yin, K., Surface and Coatings Technology, vol. 88, pg. 162, 1996.
13. "Pulse Reverse Electrodeposition for Metallization and Planarization of Semiconductor Substrates," U.S. Patent Application No. 09/172/299, Oct. 14, 1998. (Allowed by the USPTO)
14. "Electrodeposition of Metals in Small Recesses for Manufacture of High Density Interconnects Using Modulated Electric Fields," U.S. Patent Application No. 09/239,811, Jan. 29, 1999. (Allowed by the USPTO)