Aligned room-temperature bonding of silicon wafers in vacuum by argon beam surface activation

Journal of Micromechanics and Microengineering

Volumn 15, Issue 2, 2005, Pages 290-295

  Takagi, Hideki ^a   Maeda, Ryutaro ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ARGON; MICROELECTROMECHANICAL DEVICES; PLASMAS; RESIDUAL STRESSES; SOLIDIFICATION; SURFACE TREATMENT; ULTRAHIGH VACUUM;

BONDING STRENGTH; INORGANIC ADHESIVES; PLASMA TREATMENT; WAFER BONDINGS;

SILICON WAFERS;

EID: 14244265225     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/2/007     Document Type: Article

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