Polymeric material adhesion and common failure mechanisms in the assembly of jettable fluid devices

International Conference on Digital Printing Technologies

Volumn , Issue , 2004, Pages 815-819

  Krawiec, Susan ^a   Chan, Vivian ^a   Frimanson, Robert ^a   Cheng, Chih Min ^a   Palmer, Robert ^a  

^a Emerson and Cuming Company   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; FAILURE ANALYSIS; FASTENERS; INK; MICROELECTROMECHANICAL DEVICES; PIEZOELECTRIC MATERIALS; POLYMERS; PRINTING;

FAILURE MECHANISMS; FLUID JETTING; PIEZO-ELECTRIC CRYSTALS; THERMAL BUBBLES;

FLUIDIC DEVICES;

ADHESION; FAILURE; FASTENERS; FLUIDICS; INK; POLYMERS; PRINTING;

EID: 14244252831     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. P. Calvert, G. Jabbour, Y. Yoshioka, "Multilayer Inkjet Printing of Biopolymers, OLED's and Other Devices", IMAPS Workshop Printing an Intelligent Future, Incline Village, NE, March 8-10, 2002.
2. Alvin G. Keene, "12th Annual Ink Printing Conference", Scottsdale, Arizona, May 5-7, 2003.
3. Alvin G. Keene, "10th Annual Digital Printing Suppliers Conference", Scottsdale, Arizona, May 7-9, 2003.
4. Stephen F. Pond, "Inkjet Technology", Torrey Pines Research Publisher, Carlsbad, California
5. L.T. Creagh and, P. J. Frost., "Piezoelectric Ink Jet and Organic Electronic Materials", MAPS Workshop Printing an Intelligent Future, Incline Village, NE, March 8-10, 2002.
6. Mike Willis, "Ink Jet Academy", Ink Jet Developers Conference 2003, Scottsdale, Arizona, February 3-4, 2003.