Thermodynamic study of solid copper-nickel alloys by use of copper-beta-alumina

Journal of Physics and Chemistry of Solids

Volumn 66, Issue 2-4, 2005, Pages 251-255

  Oishi, Toshio ^a   Tagawa, Shinya ^a   Tanegashima, Soichiro ^a  

^a KANSAI UNIVERSITY   (Japan)

Author keywords

A. Alloys; D. Thermodynamic properties

Indexed keywords

ALUMINA; ELECTROLYTES; ENTHALPY; ENTROPY; FREE ENERGY; IONS; SOLID SOLUTIONS;

ELECTROMOTIVE FORCE (EMF); GALVANIC CELLS; TRIVALENT MOBILE IONS;

COPPER ALLOYS;

EID: 13844307670     PISSN: 00223697     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jpcs.2004.08.038     Document Type: Conference Paper

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