Whisker formation potential in Pb-free electroplated connector finishes

Circuits Assembly

Volumn 16, Issue 2, 2005, Pages 52-59

  Rickett, Brett ^a   Elmgren, Pete ^a   Flowers, George ^b   Gale, S ^b   Suhling, Jeff ^b  

^a MOLEX INC   (United States)

^b AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION FACTORS; ENVIRONMENTAL AGING; SURFACE RECONSTRUCTION; TIN-COPPER PLATING;

AGING OF MATERIALS; ATMOSPHERIC HUMIDITY; BENDING (DEFORMATION); CONNECTORS (STRUCTURAL); ELECTROPLATING; METAL FINISHING; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; THERMAL CYCLING; THERMAL EXPANSION; TIN;

CRYSTAL WHISKERS;

EID: 13844281209     PISSN: 10540407     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (1)

1. J.A. Brusse, G.J. Ewell and J.P. Siplon, "Tin Whiskers: Attributes and Mitigation," CARTS 2002:22nd Capacitor and Resistor Technology Symposium, 2002.