Thermally conductive electrically insulating aromatic silicone film adhesive for the New Horizons mission

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5526, Issue , 2004, Pages 79-90

  Caruso, Keith S ^a   Hogue, Patrick ^a   Monib, Kareem M ^b  

^a JOHNS HOPKINS UNIVERSITY APPLIED PHYSICS LABORATORY   (United States)

^b Arlon Silicone Technologies Division   (United States)

Author keywords

Activation energy; Creep; Diffusion; Film adhesive; Modulus; Outgassing; Silicone; Stiffness; Viscoelastic

Indexed keywords

ACTIVATION ENERGY; ADHESIVES; CONDENSATION; CREEP; DEGASSING; DIFFUSION; ELECTRIC RESISTANCE; HEAT SINKS; STIFFNESS; THERMAL CONDUCTIVITY; VISCOELASTICITY;

CRYOGENIC TEMPERATURES; FILM ADHESIVES; MODULUS; MULTI-SPECTRAL VISIBLE IMAGING CAMERA (MVIC);

SILICONES;

EID: 13444304260     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.560430     Document Type: Conference Paper

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