Spray cooling thermal management for increased device reliability

IEEE Transactions on Device and Materials Reliability

Volumn 4, Issue 4, 2004, Pages 605-613

  Cader, Tahir ^a   Westra, Levi J ^a   Eden, Richard C ^a  

^a Isothermal Systems Research   (United States)

Author keywords

CMOS; Crowbar current; Junction temperature; Leakage current; Power dissipation; Reliability; Spray cooling; Transient response

Indexed keywords

CMOS INTEGRATED CIRCUITS; COOLING; ENERGY DISSIPATION; HEAT TRANSFER; LEAKAGE CURRENTS; MICROPROCESSOR CHIPS; RELIABILITY; SEMICONDUCTOR JUNCTIONS;

CROWBAR CURRENT; JUNCTION TEMPERATURE; SPRAY COOLING; TRANSIENT RESPONSE;

ELECTRONIC EQUIPMENT;

EID: 13444254016     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2004.838978     Document Type: Article

References (7)

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3. R. C. Eden, "Comparison of GaAs device approaches for ultrahighspeed VLSI," in Proc. IEEE, vol. 70, Jan. 1982, pp. 5-12.
4. H. Im, T. Inukai, H. Gomyo, T. Hiramoto, and T. Sakurai, "VTCMOS characteristics and its optimum conditions predicted by a compact analytical model," in Proc. Int. Symp. Low-Power Electronics and Design, Aug. 2001, pp. 123-128.
5. J. B. Burr, "Cryogenic ultra low power CMOS," in IEEE Int. Symp. Low Power Electronics, 1995, p. 9.4. and references cited therein.
6. T. Cader, M. C. Harris, C. Tilton, and B. H. Tolman, "Spray cooling thermal management for semiconductor chips undergoing burn-in," in Proc. InterPACK 2003, Maui, HI, 2003, Paper IPACK2003-35137.
7. T. Cader and D. Tilton, "Implementing spray cooling thermal management in high heat flux applications," presented at the Panel on Cooling Technologies for High Flux Applications, ITHERM 2004, Las Vegas, NV, 2004.