Factors limiting the measurement of residual stresses in thin films by nanoindentation

Thin Solid Films

Volumn 447-448, Issue , 2004, Pages 251-257

  Lepienski, C M ^a   Pharr, G M ^b,c   Park, Y J ^b,c   Watkins, T R ^c   Misra, A ^d   Zhang, X ^d  

^a FEDERAL UNIVERSITY OF PARANÁ   (Brazil)

^b University of Tennessee Knoxville   (United States)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

^d LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

Chromium; Copper; Nanoindentation; Stress

Indexed keywords

CHROMIUM PLATING; COMPUTER SIMULATION; ELASTIC MODULI; FINITE ELEMENT METHOD; RESIDUAL STRESSES; SILICON; VICKERS HARDNESS TESTING; X RAY DIFFRACTION ANALYSIS;

FINITE ELEMENT SIMULATIONS; NANOINDENTATION;

THICK FILMS;

EID: 1342344895     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)01103-9     Document Type: Conference Paper

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