Non-destructive characterization of resin-based filling materials using Electronic Speckle Pattern Interferometry

Dental Materials

Volumn 20, Issue 4, 2004, Pages 377-382

  Yap, Adrian U J ^a,b   Tan, Albert C S ^a   Quan, C ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Composite resin; Dental material; Electronic speckle pattern interferometry; Flexural; Interferometry; Modulus

Indexed keywords

BENDING STRENGTH; ELASTIC MODULI; INTERFEROMETRY; LOADS (FORCES); NONDESTRUCTIVE EXAMINATION; RESINS; SPECKLE; STANDARDS;

ELECTRONIC SPECKLE PATTERN INTERFEROMETRY (ESPI); FLOWABLE COMPOSITES;

DENTAL MATERIALS;

COMPOMER; F2000 CEMENT; FILTEK A110 COMPOSITE RESIN; FILTEK FLOW; FILTEK Z250; GLASS IONOMER; RESIN; SILICON DIOXIDE; Z100 COMPOSITE RESIN; ZIRCONIUM;

ANALYSIS OF VARIANCE; ARTICLE; CHEMISTRY; DENTAL CARE; DENTAL SURGERY; ELASTICITY; INTERFEROMETRY; LASER; MATERIALS TESTING; METHODOLOGY; NONPARAMETRIC TEST; PLIABILITY;

ANALYSIS OF VARIANCE; COMPOMERS; COMPOSITE RESINS; DENTAL RESTORATION, PERMANENT; DENTAL STRESS ANALYSIS; ELASTICITY; GLASS IONOMER CEMENTS; INTERFEROMETRY; LASERS; MATERIALS TESTING; PLIABILITY; SILICON DIOXIDE; STATISTICS, NONPARAMETRIC; ZIRCONIUM;

EID: 1342306742     PISSN: 01095641     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.dental.2003.06.002     Document Type: Article

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