Polyamide nanocomposites for extrusion coating applications

TAPPI European PLACE Conference

Volumn 2, Issue , 2003, Pages 1451-1480

  Schwarz, P ^a   Mahlke, M ^a  

^a Bayer Polymers ^*

Author keywords

[No Author keywords available]

Indexed keywords

CLAY; CREEP; ELASTIC MODULI; EXTRUSION; FILLERS; FOOD PRODUCTS; FRACTURE TOUGHNESS; PACKAGING; POLYAMIDES; STIFFNESS; TRANSPARENCY;

FOOD PACKAGING; POLYMER MATRIX;

NANOSTRUCTURED MATERIALS;

CLAY; EXTRUSION; FOOD; PACKAGING; POLYAMIDES;

EID: 1342303638     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Allied Signal Inc, "Polymer nanocomposites formed by melt processing of a polymer and an exfoliated layered material derivatized with reactive organo silanes", Patent W09311190
2. Wolff Walsrode AG, "Flexible film improved with a fine spherulitic polyamide layer containing nanoscalar, anisotropic nucleating agents", Patent WO-A-00/23515
3. Ube Industries, Toyota Motor Co Ltd, Toyoda Chuo Kenkyusho KK, "Material for molded article and film having liquid or gas barrier property, method for producing the same and use of the same", Patent EP0358415
4. Institut f. neue Materialien gGmbH, Bayer AG, "Polyamid moulding compositions containing nanodisperse fillers and films or hollow articles containing such polyamid layer", Patent EP0810259