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Volumn 5062, Issue 2, 2002, Pages 806-813
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Boundary conditioning of capacitive MEMS devices through fabrication methods and operating environments
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Author keywords
Boundary conditioning; Dynamic behavior; Electrostatic field; MEMS; Microfabrication; Microsystems
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Indexed keywords
BOUNDARY CONDITIONS;
DAMPING;
DEPOSITION;
ELASTICITY;
ELECTROSTATICS;
RESIDUAL STRESSES;
SENSORS;
STIFFNESS;
THERMAL CYCLING;
LORENTZ FORCE;
MICROSYSTEMS;
MICROELECTROMECHANICAL DEVICES;
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EID: 1342290835
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (3)
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