The effect of tri-junction conditions in droplet solidification

Journal of Crystal Growth

Volumn 264, Issue 1-3, 2004, Pages 452-462

  Ajaev, Vladimir S ^a   Davis, Stephen H ^b  

^a SOUTHERN METHODIST UNIVERSITY   (United States)

^b NORTHWESTERN UNIVERSITY   (United States)

Author keywords

A1. Solidification; B1. Alloys; B1. Metals

Indexed keywords

ADAPTIVE ALGORITHMS; ALUMINUM; BINARY ALLOYS; COMPUTER SIMULATION; CONTACT ANGLE; DENSITY (SPECIFIC GRAVITY); FINITE ELEMENT METHOD; GALLIUM; HEAT FLUX; SOLIDIFICATION; SURFACE TENSION; THERMAL CONDUCTIVITY; TOPOLOGY; VECTORS;

DENSITY RATIOS; DROPLET SOLIDIFICATION; TRI-JUNCTION CONDITIONS;

INTERFACES (MATERIALS);

EID: 1342285472     PISSN: 00220248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jcrysgro.2003.11.119     Document Type: Article

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