Optimizing the fluid dispensing process for immersion lithography

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 6, 2004, Pages 3454-3458

  Abdo, A ^a,c   Nellis, G ^a   Wei, A ^a   El Morsi, M ^a   Engelstad, R ^a   Brueck, S R J ^b   Neumann, A ^b  

^a University of Wisconsin Madison   (United States)

^b UNIVERSITY OF NEW MEXICO   (United States)

^c IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE WAFERS; DISPENSE VELOCITY; GAP HEIGHT; IMMERSION LITHOGRAPHY;

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; DISPENSERS; FLOW OF FLUIDS; MATHEMATICAL MODELS; OPTIMIZATION; REFRACTIVE INDEX; SURFACE PROPERTIES; SURFACE TENSION; THIN FILMS;

PHOTOLITHOGRAPHY;

EID: 13244286647     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1824065     Document Type: Conference Paper

References (6)

1. M. Switkes and M. Rothschild, J. Microlithog., Microfabr., Microsyst. 1, 225 (2002).
2. R. R. Kunz, M. Switkes, R. F. Sinta, J. E. Curtin, R. H. French, R. C. Wheland, C.-P. Chai Kao, M. P. Mawn, L. Lin, P. M. Wetmore, V. J. Krukonis, and K. Williams, J. Microlithog., Microfabr., Microsyst. 3, 73 (2004).
3. A. Wei, G. Nellis, A. Abdo, R. Engelstad, C.-F. Chen, M. Switkes, and M. Rothschild, J. Microlithog., Microfabr., Microsyst. 3, 28 (2004).
4. A. Wei, A. Abdo, G. Nellis, R. Engelstad, J. Chang, E. Lovell, and W. Beckman, J. Vac. Sci. Technol. B 21, 2788 (2003).
5. A. Wei, A. Abdo, G. Nellis, R. Engelstad, J. Chang, E. Lovell, and W. Beckman, Microelectron. Eng. 73-74, 29 (2004).
6. A. Wei, M. El-Morsi, G. Nellis, and R. Engelstad, J. Vac. Sci. Technol. B, these proceedings.