Stray grain formation, thermomechanical stress and solidification cracking in single crystal nickel base superalloy welds

Science and Technology of Welding and Joining

Volumn 9, Issue 6, 2004, Pages 472-482

  Park, J W ^a,b   Vitek, J M ^a   Babu, S S ^a   David, S A ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

^b Samsung Electro Mechanics   (South Korea)

Author keywords

Crack; Single crystal; Stray grains

Indexed keywords

CRACK INITIATION; CRACKS; CRYSTAL ORIENTATION; DIFFUSION; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; HEAT CONDUCTION; SINGLE CRYSTALS; SOLIDIFICATION; SPECIFIC HEAT; STRESS CONCENTRATION; STRESSES; SUPERALLOYS; THERMAL EXPANSION; WELDING;

LASER WELDS; SOLIDIFICATION CRACKING; STRAY GRAINS; THERMOMECHANICAL STRESSES;

WELDS;

EID: 12944286342     PISSN: 13621718     EISSN: None     Source Type: Journal    
DOI: 10.1179/136217104225021841     Document Type: Article

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