A genetic algorithm approach to bin packing in an ion plating cell

Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture

Volumn 219, Issue 1, 2005, Pages 1-13

  Chan, F T S ^a   Au, K C ^a   Chan, P L Y ^a  

^a UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Bin packing; Genetic algorithms; Ion plating; Quality

Indexed keywords

COMPUTATIONAL METHODS; ELECTROPLATING; EVAPORATION; GENETIC ALGORITHMS; IONS; MATHEMATICAL MODELS; OPTIMIZATION; PACKING; QUALITY CONTROL; HEURISTIC ALGORITHMS; METAL FINISHING; PLATING;

BIN PACKING; BIN PACKING GENETIC ALGORITHMS (BPGA); ION PLATING; PRODUCTION EFFICIENCY; BIN PACKING GENETIC ALGORITHMS; BIN PACKING PROBLEM; COMPUTATIONAL RESULTS; GENETIC ALGORITHM (GAS); GENETIC ALGORITHM APPROACH; OPTIMIZATION PROBLEMS; QUALITY OF PRODUCT;

PROBLEM SOLVING; ION IMPLANTATION;

EID: 12844283930     PISSN: 09544054     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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