Thermal characteristics of an X-ray mask during pattern transfer

Microelectronic Engineering

Volumn 41-42, Issue , 1998, Pages 287-290

  Resnick, D J ^a   Pendharkar, S V ^a   Dauksher, W J ^a   Cummings, K D ^a   Laudon, M F ^b   Romanowicz, B ^b   Renaud, P ^b   Engelstad, R L ^c  

^a MOTOROLA INC   (United States)

^b EPFL   (Switzerland)

^c UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; MEMBRANES; SUBSTRATES; TEMPERATURE; THERMAL EFFECTS; X RAY LITHOGRAPHY;

PATTERN TRANSFER;

MASKS;

EID: 12844283571     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(98)00066-5     Document Type: Article

References (6)

1. M. Mondol, H. Li, G. Owen and H. I. Smith, J. Vac. Sci. Technol. B 12, 4024 (1994).
2. W. J. Dauksher, D. J. Resnick, K. D. Cummings, J. Baker, R. B. Gregory, N. D. Theodore, J. A. Chan, W. A. Johnson, C. J. Mogab, M. -A. Nicolet and J. S. Reid, J. Vac. Sci. Technol. B 13, (1995).
3. D. J. Resnick, S. V. Pendharkar, W. J. Dauksher, K. D. Cummings, W. A. Johnson and C. Constantine, Microelectronic Engineering 30 (1996).
4. S. V. Pendharkar, D. J. Resnick, W. J. Dauksher, K. D. Cummings, I. Tepermeister and W. T. Conner, J. Vac. Sci. Technol. A 15, (1997).
5. "VLSI Electronics Microstructure Science", Vol 8. Academic Press, (1984).
6. M. F. Laudon, K. A. Thole, R. L. Engelstad, D. J. Resnick, K. D. Cummings and W. J. Dauksher, J. Vac. Sci Technol. B 13, (1995).