Stressmigration studies on dual damascene Cu/oxide and Cu/low k interconnects

Materials Research Society Symposium Proceedings

Volumn 812, Issue , 2004, Pages 385-390

  Back, Won Chong ^a   Ho, Paul S ^a   Lee, Jeong Gun ^b   Hwang, Sung Bo ^b   Choi, Kyeong Keun ^b   Maeng, Jong Sun ^b  

^a The University of Texas at Austin   (United States)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; DIFFUSION; ELECTRIC RESISTANCE; FAILURE ANALYSIS; OXIDES; RELIABILITY; STRESS ANALYSIS; TENSILE STRESS; THERMAL EFFECTS;

HIGH TEMPERATURE STRESSING (HTS); STRESS-INDUCED VOID FORMATION (SIV); STRESSMIGRATION; WHEATSTONE BRIDGE METHOD;

INTERCONNECTION NETWORKS;

EID: 12844281084     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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