New hybrid low-k dielectric materials prepared by vinylsilane polymerization

Materials Research Society Symposium Proceedings

Volumn 812, Issue , 2004, Pages 25-30

  Kang, Jung Won ^a   Kim, Byung Ro ^a   Kang, Gwi Gwon ^a   Moon, Myung Sun ^a   Choi, Bum Gyu ^a   Ko, Min Jin ^a  

^a LG Chemical Ltd   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL BONDS; COATINGS; CONDENSATION; CURING; FRACTURE TOUGHNESS; INTERCONNECTION NETWORKS; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; PERMITTIVITY; POLYMERIZATION; POLYMERS; SILANES; SOL-GELS;

CHEMICAL-MECHANICAL PLANARIZATION (CMP); LOW-K DIELECTRIC MATERIALS; VINYLSILANE POLYMERIZATION; VINYLTRIMETHOXYSILANE (VTMS);

DIELECTRIC MATERIALS;

EID: 12844278652     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-812-f3.6     Document Type: Conference Paper

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