Mask specifications for 193-nm lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2884, Issue , 1996, Pages 562-571

  Maurer, Wilhelm ^a  

^a SIEMENS AG   (Germany)

Author keywords

Linewidth error budget; Mask defect printability; Mask repair; Mask specifications; Optical lithography

Indexed keywords

BUDGET CONTROL; DEFECTS; FABRICATION; LINEWIDTH; MAINTENANCE; PHOTOLITHOGRAPHY; PHOTOMASKS; REPAIR;

193NM LITHOGRAPHIES; CORNER ROUNDING; DRAM DEVICES; LINEAR PATTERNS; LINEWIDTH UNIFORMITIES; LINEWIDTH VARIATIONS; LITHOGRAPHY PROCESSES; LITHOGRAPHY SIMULATIONS; MASK DEFECT PRINTABILITY; MASK REPAIR; MASK WRITINGS; NO DEFECTS; OPTICAL LITHOGRAPHY; PROCESS WINDOWS; ROADMAP; ROADMAPS;

SPECIFICATIONS;

EID: 12844258582     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.262841     Document Type: Conference Paper

References (7)

1. W. Maurer, K. Satoh, D.J. Samuels, T. Fischer, "Pattern transfer at k1 = 0.5: get 0.25 μm lithography ready for manufacturing", Optical Microlithography IX, SPIE 2726, p. 113, 1996
2. J.N. Wiley, "Effect of Stepper Resolution on the Printability of Submicron 5x Reticle Defects, Optical/Laser Microlithography II, SPIE 1088, p. 58, 1989
3. K. Brown, "National Lithography Roadmap Wafer Requirements in the Year 2000", 14th Symposium on Photomask Technology and Management, SPIE 2322, p. 402, 1994.
4. B.J. Lin, "The Exposure-Defocus Forest", Jpn. J. Appl. Phys., Vol. 33, p. 6756, 1994
5. J.N. Wiley, J.A. Reynolds, "Device Yield and Reliability by Specification of Mask Defects", Solid State Technology, July 1993, p. 65, 1993
6. R. A. Ferguson et al., "Application of an aerial image measurement system to mask fabrication and analysis", Photomask Technology and Management, SPIE 2087, p. 131, 1993
7. W. Maurer, D. Samuels, "Masks for 0.25 micron lithography", Photomask and X-Ray Mask Technology, SPIE 2254, p. 85, 1994