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Volumn 22, Issue 4, 2004, Pages 580-586

Diffusion bonding of TiAl intermetallic compound to Ti-6Al-4V alloy and pure titanium

Author keywords

Diffusion bonding; Intermetallic compound; Kirkendall void; Reaction layer; Tensile strength; Ti; Ti 6Al 4V; TiAl

Indexed keywords

CRYSTALS; DIFFUSION; INTERMETALLICS; MICROSTRUCTURE; TENSILE STRENGTH; TITANIUM;

EID: 12744256728     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.22.580     Document Type: Article
Times cited : (4)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.