Etch film and pit structure of AA1050 aluminum plates electrograined in nitric and hydrochloric acids

Journal of the Electrochemical Society

Volumn 148, Issue 3, 2001, Pages

  Lin, C S ^a   Fu, S M ^a  

^a DA YEH UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 12444256482     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1350677     Document Type: Article

References (5)

1. A. Nishino and T. Kakei, U.S. Pat. 5,141,605 (1992).
2. J.-C. Huang, in Aluminum Surface Treatment Technology, R. S. Alwitt and G. E. Thompson, Editors, PV 86-11, p. 2, The Electrochemical Society Proceedings Series, Penninston, NJ (1986).
3. J. E. Walls, R. I. Dragon, and A. Dunder, U.S. Pat. 4,336,113 (1982).
4. T. Suzuki and Y. Hayashi, J. Surf. Finish. Soc. Jpn., 30, 541 (1979).
5. A. J. Dowell, Trans. Inst. Met. Finish., 57, 138 (1979).