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Volumn 2, Issue , 2003, Pages 517-525
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Miniature loop heat pipes for electronic cooling
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Author keywords
[No Author keywords available]
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Indexed keywords
CONSUMER ELECTRONICS;
COOLING;
ELECTRONICS ENGINEERING;
HEAT PIPES;
HEAT TRANSFER;
MICROPROCESSOR CHIPS;
SYSTEMS ANALYSIS;
THERMAL EFFECTS;
TUBING;
COOLING SYSTEMS;
ELECTRONICS PACKAGING;
HEAT FLUX;
NASA;
STAINLESS STEEL;
TEMPERATURE CONTROL;
ELECTRONIC COOLING;
THERMAL MANAGEMENT;
COMMERCIAL ELECTRONICS;
ELECTRICAL POWER;
HEAT REJECTION;
HEAT TRANSPORT;
HEAT TRANSPORT CAPABILITY;
HEAT TRANSPORT DEVICES;
LONG DISTANCES;
MECHANICAL MOVING PARTS;
MINIATURE LOOP HEAT PIPES;
OPERATIONAL ISSUES;
PACKAGING SIZE;
POWER DISSIPATION;
SPACE PROGRAMS;
STAINLESS STEEL TUBING;
THERMAL CONTROL TECHNOLOGY;
WORKING FLUID;
ELECTRONICS PACKAGING;
HEAT PIPES;
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EID: 1242333047
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1115/ipack2003-35245 Document Type: Conference Paper |
Times cited : (31)
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References (6)
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