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Volumn 1, Issue , 2003, Pages 665-671
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Packaging of arrayed waveguide grating demultiplexer and subsequent device characterization
a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
COOLING;
DEMULTIPLEXING;
DENSE WAVELENGTH DIVISION MULTIPLEXING;
DIFFRACTION GRATINGS;
HEATING;
REFRACTIVE INDEX;
THERMODYNAMIC STABILITY;
WAVEGUIDES;
ALIGNMENT;
ELECTRONICS PACKAGING;
PACKAGING;
THERMOANALYSIS;
ARRAYED WAVEGUIDE GRATING (AWG);
DEMULTIPLEXERS;
A-THERMAL;
ACRYLATE POLYMERS;
AWG-DEVICES;
CENTER WAVELENGTH;
COOLING PROCESS;
DEVICE CHARACTERIZATION;
LOW LOSS;
OPTICAL ALIGNMENTS;
OPTICAL POWER;
PACKAGE CHARACTERIZATION;
PEAK WAVELENGTH;
SET-UPS;
SPECTRAL RESPONSE MEASUREMENTS;
TEST RESULTS;
THEORETICAL CALCULATIONS;
THERMAL SHIFT;
THERMAL STABILITY;
ELECTRONICS PACKAGING;
ARRAYED WAVEGUIDE GRATINGS;
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EID: 1242331989
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1115/ipack2003-35239 Document Type: Conference Paper |
Times cited : (2)
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References (5)
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