Indirect cooling of IC chips using a two phase closed thermosyphon loop

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 337-342

  Gima, Satoru ^a   Nagata, Takashi ^a   Zhang, Xing ^b   Fujii, Motoo ^b  

^a UNIVERSITY OF THE RYUKYUS   (Japan)

^b KYUSHU UNIVERSITY   (Japan)

Author keywords

Electronic Cooling; Fluorinert; IC Package; Notebook Computer; Two Phase Thermosyphon

Indexed keywords

CAPACITORS; EVAPORATIVE COOLING SYSTEMS; EVAPORATORS; FINS (HEAT EXCHANGE); FLOW PATTERNS; HEAT TRANSFER; LAPTOP COMPUTERS; NATURAL CONVECTION; ATMOSPHERIC TEMPERATURE; CAPILLARY FLOW; CHIP SCALE PACKAGES; CONDENSERS (LIQUEFIERS); COOLING; PACKAGING; SIPHONS; SURFACE PROPERTIES;

ELECTRONIC COOLING; FLUORINERT; IC PACKAGES; TWO PHASE THERMOSYPHON; IC PACKAGE; NOTE-BOOK COMPUTER; TWO-PHASE THERMOSYPHON;

CHIP SCALE PACKAGES; EVAPORATORS;

EID: 1242331894     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35148     Document Type: Conference Paper

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