Design optimization of a router board using computational fluid dynamics

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 35-39

  Dake, Timothy J ^a   Majdalani, Joseph ^a   Narasimhan, Susheela ^b  

^a Marquette University   (United States)

^b CISCO SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; HEAT LOSSES; HEAT SINKS; HEAT TRANSFER; OPTIMIZATION; PRESSURE DROP; ROUTERS; INTERNET;

NETWORK EQUIPMENT BUILDING SYSTEMS (NEBS); THERMAL MANAGEMENT; COOLING CAPACITY; DESIGN EFFORT; DESIGN OPTIMIZATION; INTERNET MARKETS; POWER DISSIPATION; POWER REQUIREMENT;

PRINTED CIRCUIT BOARDS; ELECTRIC LOSSES;

EID: 1242309453     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35338     Document Type: Conference Paper

References (4)

1. Lee, S., Culham, J. R., and Yovanovich, M. M., 1991, "Effect of Common Design Parameters on the Thermal Performance of Microelectronic Equipment. Part 1 Natural Convection," Heat Transfer in Electronic Equipment, pp. 47-54.
2. Lee, S., 1995, "Optimum Design and Selection of Heat Sinks," Eleventh IEEE SEMI-THERM Symposium, pp. 48-54.
3. Patel, C. D., and Belady, C. L., Modeling and Metrology in High Performance Heat Sink Design, Hewlett Packard Laboratories, Palo Alto, California, 1997.
4. Icepak Reference Manual, 3.1 ed., Fluent Inc., Palo Alto, California, 1999.