System-level transient thermal analysis for performance optimization of high power microelectronics

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 435-442

  Chiriac, Victor Adrian ^a   Lee, Tien Yu Tom ^a   Chen, H S ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SOFTWARE; ELECTRONIC EQUIPMENT TESTING; ELECTRONICS PACKAGING; ENERGY DISSIPATION; FINITE VOLUME METHOD; HEAT FLUX; HEAT SINKS; HEAT TRANSFER; POWER AMPLIFIERS; THERMAL CONDUCTIVITY; HEATING; MICROELECTRONICS; MIXED CONVECTION; OPTIMIZATION; THERMAL CYCLING; THERMOANALYSIS;

DEVICE UNDER TEST (DUT); THERMAL OPTIMIZATION; DEVICE OPERATIONS; DEVICE TESTING; FINITE-VOLUME; FLOW AND HEAT TRANSFER; HEATING-COOLING CYCLE; HIGH-POWER; NORMAL TEST; NUMERICAL STUDIES; OPTIMAL OPERATION; PEAK TEMPERATURES; PERFORMANCE OPTIMIZATIONS; POWER LEVELS; POWER SOURCES; STEADY STATE; SYSTEM DESIGN; SYSTEM LEVELS; THERMAL BEHAVIORS; THERMAL CYCLE; THERMAL PERFORMANCE; TIME DURATION; TRANSIENT THERMAL ANALYSIS;

MICROELECTRONICS; MATHEMATICAL MODELS;

EID: 1242309398     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35213     Document Type: Conference Paper

References (9)

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5. Phelan, Patrick, Chiriac, Victor, and Lee, Tom. - "Current and Future Miniature Refrigeration Cooling Technologies for High Power Microelectronic", IEEE Transactions of Components and Packaging Technologies, Vol. 25, No. 3, pp. 356-365, September 2002.
6. Chiriac, Victor A., Rosales, Jorge L., and Lee, Tien-Yu Tom - "Microelectronic Cooling Techniques Using Single and Dual Oscillatory Impinging Air Jets", Proceedings of ASME IMECE Congress, New Orleans, LA, November 17-22, 2002.
7. Mudawar, I., "Keynote Address on Thermal Management", ITHERM 2000, International Conference on Thermal Mechanics and Thermomechanical Phenomena in Electronic Systems, Las Vegas, Nevada, pp. 1-20.
8. CINDAS Material Property Database, Purdue University, West Lafayette, IN, 1997.
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