Heat transfer in triangular microchannels

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 303-307

  Dickey, J Todd ^a   Lam, Tung T ^a  

^a AEROSPACE CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; CAPACITANCE; CHANNEL FLOW; CONVERGENCE OF NUMERICAL METHODS; HEAT SINKS; MATHEMATICAL MODELS; MECHANICAL PERMEABILITY; PARTIAL DIFFERENTIAL EQUATIONS; POROUS MATERIALS; PRESSURE DROP; SURFACE ROUGHNESS; THERMOANALYSIS; VISCOSITY; ASPECT RATIO; ELECTRONICS PACKAGING; FLOW OF FLUIDS; HEAT TRANSFER;

MICROCHANNEL FLOW; SINGLE-PHASE FLOW; ANALYTICAL SOLUTIONS; CROSS SECTION; CROSS SECTIONAL AREA; HEAT TRANSFER AND FLUID FLOW; NUMERICAL HEAT TRANSFER; RECTANGULAR MICROCHANNELS; SAW-TOOTH; TRIANGULAR MICROCHANNELS;

HEAT TRANSFER; MICROCHANNELS;

EID: 1242287047     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35133     Document Type: Conference Paper

References (18)

1. Ammerman, C. and You, S., 1998, "Enhanced convective Boiling of FC-87 in Small, Rectangular, Horizontal Channels: Heat Transfer coefficient and CHF," AIAA/ASME Joint Thermophysics and Heat Transfer Conference, Volume 4, pp. 225-233.
2. Bowers, M. B. and Mudawar, I., 1994a, "Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1 - Design Criteria and Heat Diffusion Constraints," J. Electronic Packaging, Vol. 116, 290-297.
3. Bowers, M. B. and Mudawar, I., 1994b, "Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2 - Flow Rate and Pressure Drop Constraints," J. Electronic Packaging, Vol. 116, 298-305.
4. rd edition, McGraw Hill, New York.
5. Kennedy, J. E., Roach Jr., G. M., Dowling, M. F., Abdel-Khalik, S. I., Ghiaasiaan, S. M., Jeter, S. M., and Quershi, Z. H., 2000, "The Onset of Flow instability in Uniformly Heated Horizontal Microchannels," J. of Heat Transfer, Vol. 122, pp. 118-124.
6. Kim, S. J. and Kim, D., 1999, "Forced Convection in Microstructures for Electronic Equipment Cooling," J. of Heat Transfer, Vol. 121, pp. 639-645.
7. Knight, R. W., Goodling, J. S., and Hall D. J., 1991, "Optimal Thermal Design of Forced Convection Heat Sinks-Analytical,"," J. Electronic Packaging, Vol. 113, 313-321.
8. Koh, J. C. Y. and Colony, R., 1986, "Heat Transfer of Microstructures for Integrated Circuits," Int. Comm. Heat Mass Transfer, Vol. 13, pp. 89-98.
9. Peng, X. F, Wang, B. X., Peterson, B. P., and Ma, H. B., 1994, "Experimental Investigation of Heat Transfer in Flat Plates With Rectangular Micro-Channels," Int. J. Heat Mass Transfer, Vol. 38, No. 1, pp. 127-137.
10. Philips, R. J., 1990, "Micro-channel Heat Sinks," in Advances in Thermal Modeling of Electronic Components and Systems, Vol. 2, A. Bar-Cohen and A. D. Kraus, eds., ASME Press, New York, Chap. 3.
11. SINDA/G, 1999, Network Analysis Inc., Arizona State Research Park, 7855 S. River Parkway #101, Tempe, AZ.
12. Tavigururajan, T. S., 1998, "Impact of Channel Geometry on Two-Phase Flow Heat Transfer Characteristics of Refrigerants in MicroChannel Heat Exchangers," J. of Heat Transfer, Vol. 120, pp. 485-491.
13. Tien, C. L., and Kuo, S. M., 1987, "Analysis of Forced Convection in Microstructures for Electronic System Cooling," Proc. Int. Symp. Cooling Technology for Electronic Equipment, Honolulu, HI., pp. 285-294.
14. Tuckerman, D. B., and Pease, R. F. W., 1981, "High-Performance Heat Sinks for VLSI," IEEE Electron Device Lett., EDL-2, pp. 126-129.
15. nd Electronics Conference, pp. 145-149.
16. Webb, R. L. And Zhang, M., 1998, "Heat Transfer and Friction in Small Diameter Channels," Microscale Thermophysical Engineering, Vol. 2, pp. 189-202.
17. nd ed., McGraw-Hill Inc., New York, pp. 120-121.
18. Qu, W., Mala, M. and Li, D., 2000, "Pressure-Driven Water Flows in Trapezoidal Silicon Microchannels," International Journal of heat and Mass Transfer, pp. 353-364.