Analysis of pumping requirements for microchannel cooling systems

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 473-479

  Singhal, Vishal ^a   Liu, Dong ^a   Garimella, Suresh V ^a  

^a Purdue University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COOLING SYSTEMS; ELECTROOSMOSIS; ENERGY CONSERVATION; HEAT FLUX; HEAT SINKS; HYDRAULICS; NUSSELT NUMBER; PRESSURE DROP; PUMPS; THERMAL GRADIENTS; THERMAL LOAD; ELECTRONICS PACKAGING;

FLOW RATES; MICROCHANNEL COOLING SYSTEMS; MICROPUMPS; ANALYTICAL METHOD; COOLING APPLICATIONS; CRITICAL FACTORS; GRAPHICAL METHODS; HEAT REMOVAL RATES; MICRO CHANNEL HEAT SINKS; MICRO PUMP; MICROCHANNEL COOLING; PRESSURE HEADS; PUMPING REQUIREMENTS;

MICROELECTRONICS; MICROCHANNELS;

EID: 1242287023     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35237     Document Type: Conference Paper

References (10)

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