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Volumn 2, Issue , 2003, Pages 509-516
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Thermofluid Design of energy efficient and compact heat sinks
a b c |
Author keywords
[No Author keywords available]
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Indexed keywords
COOLING SYSTEMS;
ENERGY EFFICIENCY;
HEAT CONDUCTION;
HEAT CONVECTION;
HEAT SINKS;
ISOTHERMS;
LAMINAR FLOW;
MATHEMATICAL MODELS;
PARAMETER ESTIMATION;
STREAM FLOW;
THERMAL EFFECTS;
DESIGN;
ELECTRONICS PACKAGING;
FINS (HEAT EXCHANGE);
FORCED CONVECTION;
LAPTOP COMPUTERS;
SENSITIVITY ANALYSIS;
FAN PUMPING POWER;
THERMAL PACKAGING;
VOLUMETRIC FLOW RATES;
AIR COOLING SYSTEM;
ANALYTIC MODELS;
COMPACT HEAT SINK;
CONVECTIVE HEAT TRANSFER;
COOLING SOLUTIONS;
ELECTRONIC PRODUCT;
ENERGY EFFICIENT;
FIN GEOMETRY;
FLOWING STREAMS;
HEAT SINK DESIGN;
NOTE-BOOK COMPUTER;
OPERATING POINTS;
PACKAGING SOLUTIONS;
PARALLEL PLATES;
PARAMETRIC STUDY;
PARAMETRIC VARIATION;
PUMPING POWER;
TEMPERATURE RISE;
THERMO-FLUID DESIGN;
VOLUMETRIC CONSTRAINTS;
ELECTRONICS PACKAGING;
ENERGY EFFICIENCY;
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EID: 1242264367
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1115/ipack2003-35242 Document Type: Conference Paper |
Times cited : (12)
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References (14)
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