Design and fabrication of an IC encapsulation mold adhesion force tester

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 26, Issue 4, 2003, Pages 281-285

  Chang, Shyang Jye ^a   Hwang, Sheng Jye ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Adhesion force; EMC; IC packaging

Indexed keywords

ADHESION; ENCAPSULATION; EPOXY RESINS; FORCE MEASUREMENT; INTEGRATED CIRCUIT LAYOUT; INTERFACES (MATERIALS); PLASTICS MOLDING; SURFACE TREATMENT;

ADHESION FORCE; EPOXY MOLDING COMPOUND; INTEGRATED CIRCUIT PACKAGING;

ELECTRONICS PACKAGING;

EID: 1242263835     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2003.820821     Document Type: Article

References (4)

1. Standard Test Method for Tensile Properties of Adhesive Bonds, STD. ASTM D897-95a.
2. Standard Test Method for Apparent Shear Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by Tension Loading, STD. ASTM D1002-94.
3. Standard Test Method for Cleavage Strength of Metal-to-Metal Adhesive Bonds, STD. ASTM D1062-96.
4. J. U. Duncombe, "Infrared navigation - Part I: An assessment of feasibility (periodical style)," IEEE Trans. Electron Devices, vol. ED-11, pp. 34-39, Jan. 1959.