New quality cost models to optimize inspection strategies

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 26, Issue 4, 2003, Pages 328-337

  Oppermann, Martin ^a   Sauer, Wilfried ^a   Wohlrabe, Heinz ^a   Zerna, Thomas ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Assemblies; Defect rates; High mix low volume; Mathematical models; SPC

Indexed keywords

COSTS; CUSTOMER SATISFACTION; INSPECTION; MATHEMATICAL MODELS; PROCESS ENGINEERING; PRODUCTION ENGINEERING; QUALITY FUNCTION DEPLOYMENT; STATISTICAL PROCESS CONTROL; STRATEGIC PLANNING;

DEFECT RATES; HIGH MIX-LOW VOLUME; INSPECTION STRATEGY; QUALITY COST MODELS;

ELECTRONICS PACKAGING;

EID: 1242263831     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2003.822066     Document Type: Article

References (8)

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