A mode III crack in a functionally graded piezoelectric material strip

Journal of Applied Mechanics, Transactions ASME

Volumn 71, Issue 3, 2004, Pages 327-333

  Wang, B L ^a   Zhang, X H ^b  

^a UNIVERSITY OF SYDNEY   (Australia)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL COMPLEXITY; CRACKS; FUNCTIONALLY GRADED MATERIALS; MATHEMATICAL MODELS; STRESS CONCENTRATION;

COLINEAR CRACKS; CRACK GEOMETRY; ELECTRIC DISPLACEMENT INTENSITY; MATERIAL GRADIENTS;

PIEZOELECTRIC MATERIALS;

EID: 12344275666     PISSN: 00218936     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1755692     Document Type: Article

References (5)

1. Wang, B. L., and Noda, N., 2001, "Thermally Induced Fracture of a Smart Functionally Graded Composite Structure," Theor. Appl. Fract. Mech., 35(2), pp. 93-109.
2. Li, C., and Weng, G. J., 2002, "Antiplane Crack Problem in Functionally Graded Piezoelectric Materials," ASME J. Appl. Mech., 69(4), pp. 481-488.
3. Erdogan, F., and Ozturk, M., 1992, "Diffusion Problems in Bonded Nonhomogeneous Materials With an Interface Cut," Int. J. Eng. Sci., 30(10), pp. 1507-1523.
4. Gradshteyn, I. S., and Ryzhik, I. M., 1965, Tables of Integrals, Series and Products, Academic Press, San Diego, CA.
5. Erdogan, F., and Wu, B. H., 1996, "Crack Problems in FGM Layers Under Thermal Stresses," J. Therm. Stresses, 19, pp. 237-265.