Solution hardened platinum alloy flexure materials for improved performance and reliability of MEMS devices

Journal of Micromechanics and Microengineering

Volumn 15, Issue 1, 2005, Pages 43-48

  Brazzle, John D ^a   Taylor, William P ^b   Ganesh, Bala ^c   Price, James J ^d   Bernstein, Jonathan J ^e  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b Allegro Microsystems   (United States)

^c ANALOG DEVICES INC   (United States)

^d Corning Incorporated ^*  (United States)

^e CHARLES STARK DRAPER LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; CORROSION RESISTANCE; ELASTIC MODULI; ELECTRIC CONDUCTIVITY; ETCHING; FERROMAGNETISM; HYSTERESIS; PLATINUM ALLOYS; RELIABILITY; SOLUTIONS; SPUTTER DEPOSITION; THERMAL CONDUCTIVITY;

FLEXURE MATERIALS; MICROMIRROR STRUCTURES; SUBSTRATE TEMPERATURES; WET CHEMICAL ETCHING;

MICROELECTROMECHANICAL DEVICES;

EID: 12344259526     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/1/007     Document Type: Article

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