Mechanical properties of ECAE nanocrystalline copper and nickel

Journal of Metastable and Nanocrystalline Materials

Volumn 23, Issue , 2005, Pages 183-186

  Bansal, S ^a   Saxena, A ^b   Hartwig, T ^c   Tummala, Rao R ^a  

^a Georgia Institute of Technology   (United States)

^b University of Arkansas   (United States)

^c Department of Electrical and Computer Engineering   (United States)

Author keywords

Copper; ECAE; Fracture Toughness; Grain Size; Nanocrystalline; Nickel; Strength

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY; ETCHING; FRACTURE TOUGHNESS; GRAIN GROWTH; GRAIN SIZE AND SHAPE; NICKEL; STRAIN; STRENGTH OF MATERIALS;

EQUICHANNEL ANGULAR EXTRUSION (ECAE); GRAIN SIZE; NANOCRYSTALLINE COPPER; STRENGTH;

NANOSTRUCTURED MATERIALS;

EID: 12344257555     PISSN: 14226375     EISSN: None     Source Type: Journal    
DOI: 10.4028/www.scientific.net/JMNM.23.183     Document Type: Conference Paper

References (5)

1. ASTM E8-98, Standard Test Methods for Tension Testing of Metallic Materials.
2. ASTM E 1820-96, Standard Test Method for Measurement of Fracture Toughness.
3. S. K. Ganapathi, D. M. Owen and A. H. Chokshi, "The kinetics of grain growth in nanocrystalline copper", Scripta Metall., vol. 25, pp. 2699-2704, 1991.
4. Ebrahimi F., Bourne G. R., Kelly M. S., Matthews T. E., Nanostructured Materials, 11, 3, pp. 343 (1999).
5. Nieman, G.W., Weertman, J.R., Siegel, R. (1991), J. Mater. Res., 6, 1012.