Alloy electrodeposition

Electrochemical Society Interface

Volumn 13, Issue 4, 2004, Pages 23-24

  Jeerage, Kavita M ^b   Schwartz, Daniel T ^a  

^a UNIVERSITY OF WASHINGTON   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ALLOY ELECTRODEPOSITION; CODEPOSITION SYSTEM; METAL IONS; SOLDER BUMPS;

CHARGE TRANSFER; COMPOSITION; CONCENTRATION (PROCESS); ELECTROCHEMISTRY; ELECTRODEPOSITION; ELECTROLYTES; ENERGY DISPERSIVE SPECTROSCOPY; MICROELECTROMECHANICAL DEVICES; POLARIZATION; REACTION KINETICS; SURFACE ROUGHNESS;

ALLOYS;

EID: 12344249708     PISSN: 10648208     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (6)

1. J. J. Kelly, S. H. Goods, and N. Y. C. Yang, Electrochem. Solid State Lett., 6, C88 (2003).
2. M. Matlosz, J. Electrochem. Soc., 140, 2272 (1993).
3. E. J. Podiaha and D. Landolt, J. Electrochem. Soc., 144, 1672 (1997).
4. A. Brenner, Electrodeposition of Alloys, Vol. 1 and 2, Academic Press, New York (1963).
5. D. T. Schwartz, in ASM Handbook: Surface Engineering, Vol. 5, p. 274, F. Reldenbach, Editor, ASM Int., Materials Park, OH (1994).
6. S. D. Leith and D. T. Schwartz, J. MEMS, 8, 384 (1999).