Electroless copper coating on nickel foils in super-gravity field

Materials Letters

Volumn 59, Issue 6, 2005, Pages 667-670

  Gong, Yingpeng ^a   Guo, Zhancheng ^a   Lu, Weichang ^a  

^a INSTITUTE OF PROCESS ENGINEERING   (China)

Author keywords

Electroless copper plating; Plating rate; Rotational speed; Super gravity

Indexed keywords

ACCELERATION; CENTRIFUGATION; COPPER; CRYSTAL MICROSTRUCTURE; DIFFRACTION; ELECTROLESS PLATING; GRAVITATION; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION;

ELECTROLESS COPPER PLATING; PLATING RATE; ROTATIONAL SPEED; SUPER-GRAVITY;

NICKEL;

EID: 12244311238     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2004.11.007     Document Type: Article

References (8)

1. N.V. Mandich, and G.A. Krulik Plating Surf. Finish. 80 1993 68
2. M. Paunovic, and R. Arnd J. Electrochem. Sci. Technol. 130 4 1983 794
3. F. Touyeras, J.-Y. Hihn, M.-L. Doche, and X. Roizard Ultrason. Sonochem. 8 2001 285
4. C.T. Pan Microelectron. Eng. 71 2004 242 251
5. H. Tokunaga, and M. Murahara Mater. Res. Soc. Symp. Proc. 734 2003 443 448
6. C. Ramshaw Heat Recovery Syst. CHP 13 6 1993 (November) 493 513
7. Siqian Wang, and Yundi Su Phys. Dict. 1986 (October) 26
8. C.W. Lan J. Cryst. Growth 229 2001 595 600