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Volumn 575, Issue 1-2, 2005, Pages 69-74
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An Auger microscopy study of the meeting and interdiffusion of pure Pb and Bi adsorbed layers on polycrystalline Cu
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Author keywords
Auger electron spectroscopy; Bismuth; Copper; Lead; Surface diffusion
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Indexed keywords
ADSORPTION;
ANNEALING;
AUGER ELECTRON SPECTROSCOPY;
BISMUTH;
COPPER;
DEPOSITION;
DIFFUSION;
EVAPORATION;
LEAD;
SCANNING ELECTRON MICROSCOPY;
THERMOCOUPLES;
TWO DIMENSIONAL;
AUGER MICROSCOPY;
INTERDIFFUSION COEFFICIENTS;
SCANNING AUGER MICROPROBE (SAM);
SURFACE DIFFUSION;
POLYCRYSTALLINE MATERIALS;
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EID: 12244295494
PISSN: 00396028
EISSN: None
Source Type: Journal
DOI: 10.1016/j.susc.2004.11.004 Document Type: Article |
Times cited : (5)
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References (11)
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