Assembly technique for a fine-pitch, low-noise interface; joining a CdZnTe pixel-array detector and custom VLSI chip with Au stud bumps and conductive epoxy

IEEE Nuclear Science Symposium Conference Record

Volumn 5, Issue , 2003, Pages 3513-3517

  Clayton, James E ^a   Chen, C M Hubert ^b   Cook, Walter R ^b   Harrison, Fiona A ^b  

^a Polymer Assembly Technology Inc   (United States)

^b CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC NOISE; BONDING; DEMODULATION; GAMMA RAYS; GOLD; INTERFACES (MATERIALS); VLSI CIRCUITS;

APPLICATION-SPECIFIC INTEGRATED CIRCUITS (ASIC); BUMP BONDING; ENERGY RESOLUTION; GAMMA RAY SENSORS;

CADMIUM COMPOUNDS;

EID: 11944268060     PISSN: 10957863     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. T.O. Tümer, M. Claus, G.I. Visser, S. Yin, P.D. Willson, L. D'Aries, K.B. Parnham, B. Glick, J.L. Perry, T. Gamble, G. Creede, E. Worthington, J. Sparling, D. Maeding, D. Gorzen, "Preliminary Results Obtained from a Novel CdZnTe Pad Detector and Readout ASIC Developed for an Automatic Baggage Inspection System", IEEE Nuclear Science Symposium 2000, Lyon, France, Oct. 15-20, 2000.
2. rd International Conference on Radiation Effects on Semiconductor Materials, Detectors and Devices, Florence, Italy, June 28-30, 2000.
3. Jerry Jordan, "Gold Stud Bump for Flip Chip Applications", SEMI Technical Symposium (STS): International Electronics Manufacturing Technology (IEMT) Symposium 2002 Proceedings, pp. 269-283, July 2002.
4. Changhai Wang and Andrew S. Holmes, "Laser-Assisted Bumping for Flip Chip Assembly", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 2, April 2001.
5. CM Hubert Chen, Walter R Cook, Fiona A Harrison, Jiao Y. Y. Lin, Peter H Mao and Stephen M. Schindler, "Characterization of the HEFT CdZnTe Pixel Detectors", Hard X-Ray and Gamma-Ray Detector Physics V. Proc. of SPIE, Vol 5198, in print.