Wafer-bonding and thinning technologies

MRS Bulletin

Volumn 23, Issue 12, 1998, Pages 30-34

  Desmond Colinge, Cynthia A ^a   Gösele, Ulrich ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 11644265301     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/S0883769400029808     Document Type: Article

References (51)

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