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Volumn 50, Issue 1, 2003, Pages 30-33

Silicon nitride with a low friction co-efficient;Siliciumnitrid-Werkstoffe mit niedrigem Reibungskoeffizienten

Author keywords

[No Author keywords available]

Indexed keywords

FRICTION; MICROSTRUCTURE; ROLLING WEAR; SILICON NITRIDE; WEAR RESISTANCE; WEAR TESTING;

EID: 1142293744     PISSN: 07243472     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (6)

References (6)
  • 1
    • 0029378769 scopus 로고
    • Effect of the grain boundary thermal expansion coefficient on the fracture toughness in silicon nitride
    • Peterson, I. M., Tien, T Effect of the Grain Boundary Thermal Expansion Coefficient on the Fracture Toughness in Silicon Nitride, J. Am. Soc., 78 (9) 2345-5 (1995)
    • (1995) J. Am. Soc. , vol.78 , Issue.9 , pp. 2345-2345
    • Peterson, I.M.1    Tien, T.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.