Study on composite electroforming of Cu/SiCp composites

Materials Letters

Volumn 58, Issue 10, 2004, Pages 1634-1637

  Zhu, Jianhua ^a   Liu, Lei ^a   Hu, Guohua ^a   Shen, Bin ^a   Hu, Wenbin ^a   Ding, Wenjiang ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Composite electroforming; Copper based composites; SiCp

Indexed keywords

COMPOSITE MATERIALS; COPPER; CURRENT DENSITY; ELECTRIC CONDUCTIVITY; ELECTROFORMING; ELECTROPLATING; FABRICATION; IMAGE ANALYSIS; RESIDUAL STRESSES; THERMAL EXPANSION; VOLUME FRACTION; X RAY DIFFRACTION ANALYSIS;

COMPOSITE ELECTROFORMING; COPPER BASED COMPOSITES; SICP;

SILICON CARBIDE;

EID: 1142280226     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2003.08.040     Document Type: Article

References (10)

1. Renjie W.U. The present condition and prospection on metal matrix composites. Acta Metall. Sin. 33(1):1997;78-84.
2. Celis J.P., Roos J.R., Buelens C. A mathematical model for the electrolytic codeposition of particles with a metallic matrix. J. Electrochem. Soc. 134(6):1987;1402-1408.
3. Celis J.P., Roos J.R. Kinetics of deposition of alumina particles from copper sulfate plating baths. J. Electrochem. Soc. 124(10):1977;1508-1511.
4. Sadowska-Mazur J., Warwick M.E., Walker R. Electrodeposition and properties of tin-nickel/silicon carbide composite coatings. Trans. Inst. Met. Finish. 64:1976;142-148.
5. Greco V.P. Electrocomposites and their benefits. Plat. Surf. Finish. 76(7):1989;62-67.
6. Watson S. Modern electroforming. Trans. Inst. Met. Finish. 67(4):1989;89-94.
7. Watson S.A., Hart Anthony C. Electroforming. Met. Finish. 91(1):1999;395-406.
8. Bocking C., Bennett G., Dover S. The use of electroforming for engineering tool production. Trans. Inst. Met. Finish. 76(1):1998;64-68.
9. MacGeough J.A., et al. Electroforming process and application to micro/macro manufacturing. Manuf. Technol. 50(2):2001;499-514.
10. Ghouse M., Viswanathan M., Ramachandran E.G. Occlusion plating of copper-silicon carbide composites. Met. Finish. 78(3):1980;31-35.