Pressure-assisted capillary force lithography

Advanced Materials

Volumn 16, Issue 2, 2004, Pages 176-179

  Khang, Dahl Young ^a   Lee, Hong H ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; ATOMIC FORCE MICROSCOPY; BLOW MOLDING; COMPRESSION MOLDING; FLUORINE CONTAINING POLYMERS; GLASS TRANSITION; HEATING; PRESSURE EFFECTS; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SPIN COATING; THERMAL EFFECTS;

ISOPROPYL ALCOHOL; POLYDIMETHYLSILOXANE; POLYMER MELT; PRESSURE ASSISTED CAPILLARY FORCE LITHOGRAPHY; TRICHLOROETHYLENE;

PHOTOLITHOGRAPHY;

EID: 1142268969     PISSN: 09359648     EISSN: None     Source Type: Journal    
DOI: 10.1002/adma.200305673     Document Type: Article

References (13)

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13. 2, where z is the capillary rise. The calculated capillary filling time for the hard mold would be about 50 min if the filling time of the Teflon mold is used as the reference under identical conditions. As can be seen in Table 1, however, the hard mold does not get filled even after 60 min.