Direct Gravure Printing (DGP) method for printing fine-line electrical circuits on ceramics

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 27, Issue 2, 2004, Pages 109-114

  Kittilä, Marko ^a   Hagberg, Juha ^a   Jakku, Eino ^a   Leppävuori, Seppo ^a  

^a UNIVERSITY OF OULU   (Finland)

Author keywords

Fine line; Gravure; LTCC; Printing; Thick film

Indexed keywords

ALUMINA; CERAMIC MATERIALS; ELECTRIC CONDUCTORS; ELECTRIC NETWORK SYNTHESIS; ELECTRONICS PACKAGING; SILICONES; SUBSTRATES; THICK FILMS;

CONDUCTOR PASTE; DIRECT GRAVURE PRINTING; FINE LINE ELECTRICAL CIRCUITS; LOW TEMPERATURE COFIRED CERAMIC (LTCC) SUBSTRATES;

LITHOGRAPHY;

EID: 11244349809     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2004.837959     Document Type: Article

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